https://b2binpay.com/app/uploads/2023/03/Seamless-Asia-2023.png

B2BinPay 加入 Seamless Asia 2023

27 - 28 June
新达城新加坡会议展览中心
展位#E16

快来参加我们于 6 月 27 日至 28 日新加坡 举办的大型金融科技盛会 — Seamless Asia 2023!我们的 B2BinPay 团队将参加这一享有盛誉的会议,期待在#E16 展位与您会面!

关于无缝亚洲 2023

Seamless Asia 2023 是致力于探索支付、银行和商业如何重塑该地区的领先活动。这场来自全球各地的 2,500 多名与会者的全球聚会将在 Suntec Singapore Convention & 举行。展览中心,将有许多不同领域的公司、初创公司和许多专业人士。

此次活动预计将有 200 多位知名演讲者出席,其中包括来自最知名机构、金融服务公司和支付处理提供商的专业人士。与会者还将有机会了解 150 家参展商展示的最新金融科技解决方案!

舞台上的专家

在 Seamless Asia 的第一天,B2Broker 的首席产品官 Ivan Navodnyy 将作为主旨发言人登上舞台的中心。凭借对这个行业的全面了解和对其无形资产的创新思考,Ivan 一定会为所有对该行业动态感兴趣的与会者提供引人入胜的见解。如果您希望在金融科技领域保持领先地位,请不要错过这个机会参加 Seamless Asia 2023 并与我们的团队会面!确保注册 现在!希望在那里见到你!

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